Diamond performance is governed by internal structure, not just hardness. The way a particle fractures, dulls, or resists breakdown determines how it interacts with the surface. This directly affects removal rate, scratch formation, process stability, and tool life. In practice, most process variation attributed to “slurry issues” is actually a mismatch between diamond type and process conditions. 
Natural diamond behaves similarly to monocrystalline diamond in that it has cleavage planes and can fracture, but it introduces more variability due to its origin and processing. While synthetic diamonds are engineered for consistency, natural diamond may vary in shape, purity, and fracture behavior. Its value is less about performance advantage and more about application fit. Natural diamond is often preferred in plated tools and high-cleanliness environments where particle integrity and contamination control are critical. In these cases, consistency of adhesion and minimal extraneous material can outweigh the benefits of engineered fracture behavior. In loose abrasive systems, it performs comparably to monocrystalline diamond but is typically reserved for specialized or legacy processes.
Monocrystalline diamond consists of a single crystal with defined cleavage planes. Under load, the particle fractures along these planes, producing smaller fragments with fresh cutting edges. This behavior creates a self-sharpening effect that is especially valuable in bonded tools, where maintaining active cutting points is critical to consistent performance. In operation, this means the abrasive continuously renews itself rather than simply wearing smooth. The result is a stable removal rate over time without significant glazing. However, because fracture is part of the mechanism, excessive pressure can cause premature breakdown, reducing slurry effectiveness. When controlled properly, monocrystalline diamond provides a strong balance between removal efficiency and surface quality, making it well suited for lapping and intermediate polishing steps.
Polycrystalline diamond is composed of many nano-scale crystallites fused together, eliminating cleavage planes. Instead of fracturing, the particle wears gradually across its surface. This gives it significantly higher toughness and allows it to maintain structural integrity under higher pressures. In practice, polycrystalline diamond supports more aggressive processing. It can sustain higher loads without sudden breakdown, enabling higher removal rates and more predictable behavior in demanding lapping operations. The tradeoff is that it does not self-sharpen in the same way as monocrystalline diamond. As a result, edges can slowly dull, requiring process conditions to maintain effective cutting. When matched correctly to pressure and flow conditions, polycrystalline diamond delivers stable, high-throughput material removal with reduced risk of sudden defect generation.